Semiconductor Solutions
TGV Cleaner & Etcher
Equipment that removes fine glass particles and chemical residues generated during glass substrate processing, as well as contaminants inside laser-formed via holes, and precisely shapes the via holes through wet etching.
SEMICONDUCTOR SOLUTIONS
TGV Cleaner & Etcher
SPECIFICATION
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Glass sizeCustom
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ProcessEtching
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AP FieldTGV Glass
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Unit CompositionCustom
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ChemicalCustom
FEATURES
Designed to process multiple glass substrates simultaneously for maximum productivity, the equipment uniformly removes surface contaminants at the cleaning stage to ensure cleanliness and precisely forms TGV via holes through wet etching to ensure packaging reliability.
