Semiconductor Solutions
Spin Etcher
Equipment designed to remove specific areas of metal films deposited on wafer substrates using an etchant.
SEMICONDUCTOR SOLUTIONS
Spin Etcher
SPECIFICATION
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Wafer size6~12 inch
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ProcessCustom
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AP FieldWafer
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Unit CompositionCustom
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ChemicalCustom
FEATURES
Compatible with wafer chemicals and etching/wet cleaner technologies
