Semiconductor Solutions
Polishing Ver 1.8
SPAS pre-treatment equipment that interfaces with the machine to automatically polish and clean molded specimens loaded by operators.
SEMICONDUCTOR SOLUTIONS
Polishing Ver 1.8
SPECIFICATION
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Dimensions1,505(L) x 720(W) x 2,100(H)
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WeightApprox 1,500kg
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AP FieldSemiconductor
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WaferMax. 20(W) x 20(D)
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Polish JigØ30 x 5(T) / Ø48 x 7(T)
FEATURES
Applies a load of 1 to 10 N to the specimen during polishing, then rinses and cleans it using DI water while simultaneously spinning at 3,000 rpm for drying.
