Polishing Ver 3.0

Semiconductor Solutions

Polishing Ver 3.0

Equipment that automatically loads wafer specimens from stubs supplied by AMR robots, tilts the specimens from a vertical position for polishing and cleaning, and automatically unloads them.

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SEMICONDUCTOR SOLUTIONS

Polishing Ver 3.0

SPECIFICATION

Dimensions

2,815(L) x 1,530(W) x 2,000(H)
Weight

Approx 6,500kg
AP Field

Semiconductor
Wafer

10(L) x 10(W) x 0.8(T)
Polish Jig

75(D) x 75(W) x 8.5(T)

FEATURES

Designed to grip specimens horizontally by vacuum suction and polish their edges at an angle of 3° to 5°.